HyperX Part Number Decoder

The following information is designed to help you identify Kingston® HyperX ® Memory Modules by Specification

Part Number: HX429C15PB3AK2/32

  • HX
  • 4
  • 29
  • c
  • 15
  • p
  • b
  • 3
  • A
    • k2
    • /
    • 32
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HX = Product Line
  • HX - HyperX
4 = Technology
  • 3 - DDR3
  • 4 - DDR4
29 =Speed
  • 13 - 1333
  • 16 - 1600
  • 18 - 1866
  • 21 - 2133
  • 24 - 2400
  • 26 - 2666
  • 28 - 2800
  • 29 - 2933
  • 30 - 3000
  • 32 - 3200
  • 33 - 3333
  • 34 - 3466
  • 36 - 3600
  • 40 - 4000
  • 41 - 4133
  • 42 - 4266
  • 46 - 4600
C = DIMM Type
  • C - UDIMM
  • S - SODIMM
15 = CAS Latency
  • 9 - CL9
  • 10 - CL10
  • 11 - CL11
  • 12 - CL12
  • 13 - CL13
  • 14 - CL14
  • 15 - CL15
  • 16 - CL16
  • 17 - CL17
  • 18 - CL18
  • 19 - CL19
  • 20 - CL20
P = Series
  • F - FURY
  • S - Savage
  • B - Beast
  • P - Predator
  • I - Impact
B = Heat Spreader
  • Blank - Blue
  • B - Black
  • R - Red
  • W - White
3 = Revision
  • 2 - 2nd Revison
  • 3 - 3rd Revison
  • 4 - 4th Revison
A = RGB
  • Blank - Non-RGB
  • A - RGB
K4 = Kit + # of PCS
  • Blank – Single module
  • K2 - Kit of 2 modules
  • K4 - Kit of 4 modules
  • K8 - Kit of 8 modules
32 = Total Capacity
  • 4 - 4GB
  • 8 - 8GB
  • 16 - 16GB
  • 32 - 32GB
  • 64 - 64GB
  • 128 - 128GB

Glossary

Capacity

Total number of available data memory cells on a module expressed in Gigabytes (GB). For kits, listed capacity is the combined capacity of all modules in the kit.

CAS Latency

A standard, predetermined number of clock cycles for data reads/writes to or from the memory modules and the memory controller. Once the data read/write command and the row/column addresses are loaded, CAS Latency represents the wait time until the data is ready.

DDR4

DDR (Double Data Rate) Synchronous Dynamic Random Access Memory (SDRAM) fourth-generation memory technology, more commonly referred to as “DDR4.” DDR4 memory modules are not backward compatible with any previous generations of DDR SDRAM due to lower voltage (1.2V), different pin configurations and incompatible memory chip technology.

DIMM Type

UDIMM (non-ECC Unbuffered Dual In-Line Memory Module) is a long form-factor memory module with a data width of x64, most commonly used in desktop systems where error correction is not required and DIMM capacity is restricted.

SODIMM (Small Outline Dual In-Line Memory Module) is a reduced form-factor memory module intended for smaller compute systems, such as laptops, micro servers, printers or routers.

Kit

A part number that includes multiple memory modules, typically in support of dual, triple, or quad channel memory architecture. For example, K2 = 2 DIMMs in the package to equal the total capacity.

Speed (a.k.a. Frequency)

The data rate or effective clock speed that a memory module supports, measured in MHz (MegaHertz) or MT/s (Megatransfers per second). The higher the speed, the more data can be transferred per secon

Latency Timing



The information below will help illustrate the various settings that can be adjusted when setting the memory timings in the motherboard BIOS for optimum performance. Please note that these settings may vary depending on motherboard make/model or BIOS firmware version.

Sample

15
CL
-
17
tRCD
-
17
tRP/tRCP
-
20
tRA/tRD/tRAS

CAS Latency (CL): Delay between activation of a row and the reading of that row.

RAS to CAS or RAS to Column Delay (tRCD): Activates the row

Row Precharge Delay or RAS Precharge Delay (tRP/tRCP): Deactivates the row

Row Active Delay or RAS Active Delay or time to ready): Number of clock cycles between activation/deactivation of row.

Disclaimer: All HyperX products are tested to meet our published specifications. Some systems or motherboard configurations may not operate at the published HyperX memory speeds and timing settings. HyperX does not recommend that any user attempt to run their computers faster than at the published speed. Overclocking or modifying your system timing may result in damage to computer components.